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Title
Waste paperboard in composition panels
Authors
AMIR ESHRAGHI and HABIBOLLAH KHADEMIESLAM
Received
October 31, 2011
Published
Volume 46, Issue 9-10 November-December
Keywords
waste paperboard fibers, wood chips, urea-formaldehyde resin, particleboard
Abstract
Waste paperboard could potentially be used as raw material for fiber or particle based composites without the resorting,
deinking, and decontamination required for paper manufacturing. The objective of this study was to evaluate singlelayer particleboards made with various ratios of waste paperboard fibers to wood particles. Urea formaldehyde resin in
different amounts of 9 and 10% were applied. Static bending strength, internal bonding, and thickness swelling were
measured. The results indicated that applying waste paperboard fibers satisfied the minimum MOR (modulus of
rupture) and MOE (modulus of elasticity) requirements for load-bearing boards for use in humid and dry conditions,
respectively. The IB (internal bonding) values of all panel types decreased with the addition of waste paperboard fiber.
However, all of the produced panels met the IB requirement for general purpose end-use. By increasing the resin
content, all properties of the boards and particularly internal bond and thickness swelling were improved. Nevertheless,
thickness swelling values were higher than those required. For this reason, additional work needs to be done to improve
the physical properties of the particleboard produced from waste paperboard fibers.
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